BGA PCB China Manufacturer
Product Description
JingHongYi PCB (HK) Co., Limited
Bare PCB, BGA PCB, BGA Circuit Board, BGA PCB Design
we are specialized manufacturers from China, Bare PCB, BGA PCB suppliers/factory, wholesale high-quality products of BGA Circuit Board R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.
It`s significant to understand some basic terminology related to these BGA signal routing techniques. The term [via" is the most prominent. It refers to a pad with a plated hole connecting copper tracks from one PCB layer to other layers. High-density multi-layer boards may have either blind or buried vias, also known as micro-vias. Blind vias are visible only on one surface; buried vias are visible on neither surface.
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